Sputtering target can be sorted by Ceramic, Metal and Metal Alloy.
  By placing the sputtering target and board opposite to each other in a vacuum chamber and by increasing the voltage, the introduced gases such as argon becomes plasmic. During this process, the ions generated are accelerated by electric fields and hit the target. The target components rush out and stick to the board opposite to the target.
   Sputtering is a method that by using this principle creates thin films on the board ranging from angstrom units to micron orders.
   Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.
   To achieve the desired characteristics in a sputter deposited thin film, the manufacturing process used to fabricate the sputtering target can be critical. Whether the target material comprises only an element, mixture of elements, alloys, or perhaps a compound; the process to produce that defined material in a form suitable for sputtering thin films of consistent quality is as essential as the deposition run parameters perfected by the thin film process engineers and scientists.
   Most sputtering target materials can be fabricated into a wide range of shapes and sizes. There are some technical limitations to the maximum size for a given single piece construction. In such cases, a multi-segmented target can be produced with the individual segments joined together by butt or beveled joints. Commonly used targets are circular or rectangular, although other shapes including square and triangular designs can also be produced.
   Hitop specializes in the manufacturer of multi-component ceramic targets of optical, electronic, piezo and ferroelectric, superconductor and fuel cell materials for researchers everywhere.
   Our low cost metal and metal alloys include Ag, Al, Al/Cu, Al/Si/Cu, Ti/Al, Cr, Ni/Cr, Ni/Cr/Si, Ni/Cr/Al, Cu, In-Sn, Fe, Mg, Mo, Ni, Nb, Si, Ta, Ti,Hf, W, W/Ti, Zn and Zr
   Our ceramics Sputtering including such as Al2O3 , BaFe12O19, BaTa2O6, BaTiO3, CeO2, InO/SnO, ITO, Fe2O3, LaAlO3, LiCoO2, Li3PO4, MgF2, MgO, SiC, Si3N4, SiO, SiO2, SnO2, SrRuO3, SrTiO3, Ta2O5,HfO2, TiC, TiN, TiO2, Y2O3, YSZ, ZAO, and ZnO.